Low Pressure Injection Molding
Low pressure injection overmolding (LPIO) is a process used to encapsulate and protect electronic components, such as cable assemblies, from environmental factors like moisture, dust, and vibration. This process involves injecting a liquid thermoset material into a mold cavity and curing it to create a solid, durable, and waterproof coating around the assembly.
Cable assemblies are used in various industries, including aerospace, automotive, and medical, to connect different components and transfer data or power. These assemblies can be exposed to harsh environments, including extreme temperatures, chemicals, and physical stress, which can damage or compromise their performance. Overmolding cable assemblies with a protective material enhances their durability and longevity, ensuring reliable and consistent performance.
LPIO has several advantages over other encapsulation methods, such as potting and manual encapsulation. It is a cost-effective and efficient process that reduces labor costs, material waste, and cycle time. The low pressure used in LPIO also eliminates the risk of damaging delicate electronic components during encapsulation, ensuring a high-quality finished product.
To begin the LPIO process, a mold is designed and manufactured to match the shape and size of the cable assembly. The mold is then mounted onto the injection molding machine, and the cable assembly is positioned inside the mold cavity. A liquid thermoset material, typically a two-part epoxy or polyurethane, is then injected into the mold cavity under low pressure, filling the voids around the cable assembly and creating a solid, watertight seal.
The curing process takes place in the mold, and the time and temperature required depend on the specific material used. Once cured, the mold is opened, and the finished overmolded cable assembly is removed. The excess material is trimmed off, and any necessary secondary operations, such as connector assembly, are performed.
LPIO can be used to overmold various types of cable assemblies, including single wires, bundles, and connectors. The finished product is lightweight, flexible, and can withstand harsh environments, making it ideal for applications such as sensors, control systems, and power distribution.
Overall, LPIO is a reliable and efficient encapsulation process that offers several benefits for cable assemblies. It enhances their durability and longevity, reduces the risk of damage, and improves overall performance. As technology advances and the demand for smaller, more complex electronic components increases, LPIO will continue to play an essential role in ensuring their protection and reliability.
In 20 years of business there have been countless experiences that excited me, and anyone who’s worked with me has heard me say “we sell solutions”. I feel strongly about that because we do. Many businesses sell cable assemblies and wire harnesses but our aim is to create additional value in providing those cable assemblies. Often times the additional value our customers come to us for is looking for ways to manufacture an assembly more cost effectively or help improve a failing product to increase the integrity of the assembly in it’s specific application. These days the number one value we hear of course is “lead time reduction”. With supply chain issues running amok across all industries we have bolstered capacity across the board to ensure that our lead times are equal to pre-pandemic levels. When it comes to cable assemblies there are always three immediate applications that excite me:
